RESEARCH LARORATORY OF CAPILLARY-POROUS MATERIALS

          Main directions of research works of the laboratory:

• development of scientific bases of optimization of structure and properties of powder capillary-porous materials used in different fields of technics for organization of heat-mass exchange processes which take place in porous space of the material being saturated by liquid (evaporation, condensation, capillary transport etc.);
• development of scientific bases of creation of effective powder capillary structures of heat pipes, investigation and development of processes of their production;
• development of heat exchange equipment and devices with the use of heat pipes on the base of powder capillary structures

Main results being obtained in the laboratory:

• general theory of interconnected processes of capillary transport, evaporation and condensation proceeded in capillary-porous materials;
• theoretical explication of described in literature phenomenon of heat transfer coefficient' increase during evaporation from capillary-porous material at partial draining of pores space;
• methods of calculation of characteristics (limit of heat transfer, temperature distribution, thermal resistance) for heat exchange devices on the base of capillary-porous materials;
• production technologies of capillary pumpevaporators of contour heat pipes as well as of mini cylindrical and flat heat pipes;
• constructions of mobile steam generators, heat resistant refrigerators for glass fiber production and of cooling systems of distribution transformers.

          Heat pipes and heat evacuating devices on their base. High effective powder capillary structures and tech-nologies of production of heat pipes on their base are created. Heat pipes with capillary structures, designed for work in conditions of non favorable action of gravity forces, are made of a diameter from 3 mm to 80 mm and of a length from 100 mm to 900mm. Advantages of heat pipes are the following: high heat transmission ability, ability to hold the heat carrier in the capillary structure at dynamic force loads.

         The manufacturing of heat evacuators on the base of heat pipes, being designed for natural-convective and forced- convective air-cooling of power semiconductor devices with current load from 300 to 2000A, is mastered.

A high equivalent heat conductivity, little size and weight of heat pipes have given the possibility to create on their base the heat evacuators which are the size 20-40% less than traditionally used all-metal cooling radiators from a pressed aluminum powder.

         Mini heat pipes of different sizes and configurations are used on belorussian and foreign enterprises to cool elements of modern electronics

Contour heat pipes (CHP) are high effective heat transmitting devices. The first stage of CHP development was connected with their use in space apparatuses. But the reduction of their cost has given the possibility to use CHP in others fields of technique where high den-sities of heat are produced. CHP are successfully used to cool computer components, devices of power electronics, radio techniques, and laser techniques atomic energetics, machines building.